Uniconn Interconnections Technology Co., Ltd.
Update：2025/12/24
Industries
Main Industry
Hardware
Main Product/Service
Uniconn’s product portfolio includes advanced TF‑MLO substrates and packaging substrates used in high-performance computing (HPC), smartphones, IoT devices, automation systems, and consumer electronics. Their substrates feature fine-line design, high-aspe
Founded Year
2021
Unified Business No.
83201799
Status
Active
Number of Employees
0
Total Paid-in
Capital
576,837,400 (NT$)
Location of Company
Taiwan
, New Taipei City
Year of establishment, company status, responsible person, paid-in capital amount, and registered address are sourced from the "Commerce Industrial Services Portal, Department of Commerce, Ministry of Economic Affairs.
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Introduction
Uniconn Interconnections Technology Co., Ltd., founded in January 2021 and headquartered in Sanxia, New Taipei City, Taiwan, specializes in manufacturing IC test and packaging substrates. Leveraging expertise in both multilayer organic substrate (MLO) tec
